Expertise and services: femtosecond laser micromachining of various materials, including bulk processing of optically transparent glasses and crystals; direct laser writing applications; precision laser cutting; 3D processing via laser-assisted chemical etching. Photonic device integration in transparent materials: photonic crystals for beam shaping, DOE; microfabrication with conventional and advanced laser beam shapes (Gaussian, Bessel, Top-Hat); surface patterning, including LIPSS applications; deep engraving of optical materials with low surface roughness; laser lift-off employing UV laser pulses. Adaptation of the system to user-defined applications.
Laser sources:
Yb:KGW femtosecond laser system (CARBIDE, Light Conversion Ltd.): pulse duration 210 fs, wavelength 1030 nm, pulse energy up to 0.4 mJ, average power 40 W, pulse repetition rate 1-1000 kHz with second (515 nm, max 22 W at 602.7 kHz), third (343 nm, max 11 W at 602.7 kHz) and fourth (257 nm, max 2 W at 602.7 kHz) harmonics modules. Laser provides a burst-mode operation with 600 MHz (max 9 pulses per burst) and 2.1 GHz (max 25 pulses per burst) intra-burst repetition rates and COMBO regime (mixture of MHz and GHz regimes).
Yb:KGW femtosecond laser system (PHAROS Light Conversion Ltd.): pulse duration 260 fs, wavelength 1030 nm, pulse energy up to 0.2 mJ, average power 20 W, pulse repetition rate 50-610 kHz, with second, third and fourth harmonics options.
Yb:KGW femtosecond laser system (CARBIDE Light Conversion Ltd.): pulse duration 260 fs, wavelength 1030 nm, pulse energy up to 0.1 mJ, average power 5 W, pulse repetition rate 60-400KHz, with second harmonics.
Yb:KGW femtosecond laser system (PHAROS, Light Conversion Ltd.): pulse duration 260 fs, wavelength 1030 nm, pulse energy up to 0.3 mJ, average power 9 W, pulse repetition rate 25-200 kHz (pulse on demand), with optional second, third and fourth harmonics module (HIRO, Light Conversion Ltd.).
Pulsed CO2 laser (Pulstar p100, Synrad): wavelength 10.6 µm, pulse duration 0.6 ms, peak power 400 W (at 1kHz), average power 100 W, repetition rate 0-100 kHz.
Instruments and accessories
Unit 7.1: AEROTECH-based nominal 5 axis (2 rotational stages can be dismounted) nanopositioning stage: XY stages (2x ANT180L, travel range 160 mm, accuracy ±200 nm), Z Stage (ANT130L, travel range 60 mm, accuracy ±250 nm), continuous rotational stage (ANT130R, accuracy 3 arcsec, speed 200 rpm), rotational stage (ADRS150, accuracy 6 arcsec, speed 600 rpm, travel range: ± 90 deg). Fully automated.
Unit 7.2: AEROTECH-based nominal 5 axis (2 rotational stages can be dismounted) nanopositioning stage: XY stage (ABL1500WB, travel range 300 mm, accuracy ±400 nm), Z Stage (ABL15020Z, travel range 200 mm, accuracy ±500 nm), continuous rotational stage (ANT130R, accuracy 3 arcsec, speed 200 rpm), rotational stage (ADRS200, accuracy 6 arcsec, speed 600 rpm, travel range: ± 90 deg). Fully automated.
Unit 7.3: AEROTECH-based nominal 3-axis nanopositioning stage: XY stage (ANT130XY, travel range 300 mm, accuracy ± 200 nm), Z Stage (ANT130LSZ, travel range 60 mm, accuracy ±300 nm). Fully automated.
Unit 7.4: AEROTECH-based nominal 3-axis nanopositioning stage: XY stages (2x PRO225LM, travel range 600 mm, accuracy ± 15 um), 2x Z Stages (PRO165-LM, travel range 100 mm, accuracy ±4 um). Fully automated.
Unit 7.5: Home-built setup for surface micropatterning and material micro-drilling with a home-built galvanometric scanner employing a set of f-theta lenses for UV to IR spectral ranges.
Scanner Systems: SCANLAB IntelliScan 10 (343nm), IntelliScan 14 (257 nm), IntelliScan 10 (1030 nm + 515nm), ExelliScan 14 (1030 nm + 515 nm), ScanCUBE (10.6 µm).
Nanopositioning stages, scanners, and lasers are interconnected with dedicated software DMC Pro and SCA (Workshop of Photonics).
Beam shaper (Canunda-Pulse, Cailabs) for converting Gaussian to Top-Hat beam (500 um x 500 um), for 1030 nm wavelength, max pulse energy 0.1 mJ, pulse duration 300 fs.
Hydrofluoric acid vapor phase etcher (VPE 100, IDONUS) for SiO2 etching. Chemical facility for liquid HF, KOH etching.
Autocorellator (Geco, Light Conversion Ltd.), FLIR -A600 thermal imager
On request, supplementary instruments, e.g. SEM EDS, profilometer, spectrophotometer, optical microscope, etc., are available from the General Equipment list.